Thermal investigations of integrated circuits and systems at THERMINIC'02

Microelectronics thermal experts from four continents met in he fall of 2009 at the 15th THERMINIC Workshop in Leuven, elgium. The event was sponsored by the IEEE Computer Society est Technology Technical Council and the CMP Laboratory, in ooperation with the IEEE Components, Packaging, and Manuacturing Technology Society, and the European Test Technology echnical Committee. The Workshop had participants from 25 ountries. At THERMINIC, formal workshop proceedings is not pubished, but it is a tradition that the most valuable papers of the orkshop appear in special issues or special sections in leading nternational journals. These journals are selected according to the ature and scope of the workshop in the actual year. Two journals ublish papers of the 15th THERMINIC workshop: this issue in EP contains a small section and the Microelectronics Journal ublishes a larger special section based on them. One further paer, Szabo et al., “Design of a Static TIM Tester” has been pubished already in the March 2010 issue of JEP. The first paper of this special section authored by Garimella and arirchian, “Boiling Heat Transfer and Flow Regimes in